:::: DHK¼Ö·ç¼Ç ::::
ȸ»ç¼Ò°³
Àλ縻
¿¬Çõ
R&D¼¾ÅÍ
¿À½Ã´Â ±æ
Á¦Ç°¼Ò°³
Dicing Saw
Laser Saw
Grinder
Polisher & Dry Etcher
Blade & Wheel
Other Products
Wafer and die processing solutions
ÀÚ·á½Ç
°í°´Áö¿ø
ºÎ¹®º°´ã´çÀÚ
°øÁö»çÇ×
ä¿ë°ø°í
home
>
ÀÚ·á½Ç
°Ô½Ã¹° 14°Ç
¹øÈ£
Á¦Ç°À̸§
Á¦¸ñ
ÀÛ¼ºÀÚ
ÀÛ¼ºÀÏ
Á¶È¸¼ö
14
DWR1720
¼ø¼ö ÀçÈ°¿ëÀåÄ¡ DWR1720
°ü¸®ÀÚ
01-05
3517
13
Solutions
Water Jet SawÀåºñ¿¡ ÀÇÇÑ Àý´Ü
°ü¸®ÀÚ
05-17
3666
12
Solutions
DBG+DAF Laser Cutting
°ü¸®ÀÚ
05-17
3022
11
Solutions
Laser Full Dicing
°ü¸®ÀÚ
05-17
3284
10
Solutions
Thin Wafer ¸¶¹«¸® ¿¬»è
°ü¸®ÀÚ
05-17
3102
9
Solutions
TAIKO Process
°ü¸®ÀÚ
05-17
2656
8
Solutions
Thin Wafer Dicing
°ü¸®ÀÚ
05-17
3232
7
Solutions
Low-k Grooving
°ü¸®ÀÚ
05-17
2585
6
Solutions
½ºÆ®·¹½º ¸±¸®ÇÁ(µå¶óÀÌ º¼¸®½Ì)
°ü¸®ÀÚ
05-17
2517
5
Solutions
DBG Process
°ü¸®ÀÚ
05-17
2655
4
Solutions
ÆÄƼŬÁ¦°Å
°ü¸®ÀÚ
05-17
3065
3
Solutions
QFN°¡°ø
°ü¸®ÀÚ
05-17
2430
2
Solutions
DBG + µå¶óÀÌ ¿¡Äª Process
°ü¸®ÀÚ
05-17
2521
1
Solutions
ÃÊÀ½ÆÄ Dicing Application
°ü¸®ÀÚ
05-17
3034
Á¦¸ñ
³»¿ë
Á¦¸ñ+³»¿ë
ȸ¿ø¾ÆÀ̵ð
ȸ¿ø¾ÆÀ̵ð(ÄÚ)
À̸§
À̸§(ÄÚ)
and
or
µð¿¡ÀÌÄ¡ÄÉÀַ̼ç¼Ç(ÁÖ)
ÁÖ¼Ò : °æ±âµµ ¼º³²½Ã ºÐ´ç±¸ ÆDZ³·Î255¹ø±æ 28 (»ïÆòµ¿, µð¿¡ÀÌÄ¡ÄÉÀַ̼ç¼Çºôµù) ´ëÇ¥ÀüÈ : 031-639-9000 ´ëÇ¥Æѽº : 031-639-9035
Copyright(c) 2007 DHKSOLUTION All rights reserved.